Permabond ET5424 Aerospace-Grade High-Temperature 4:1 Two-Part Epoxy
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SKU:
PBND_ET5424_400ML
Regular price
$ 167.99 USD
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SKU
- Type Epoxy
- Vendor Permabond
- SKU PBND_ET5424_400ML
PERMABOND® ET5424 is a two-part epoxy adhesive designed primarily for the aerospace industry, with excellent temperature resistance following a low-temperature cure — making it well suited for assemblies that go on to see a powder-coat bake. The adhesive carries a reduced-hazards SDS for a safer working environment and an extended cure time that supports large bond areas and batch production processes.
ET5424 meets the requirements of ECSS-Q-ST-70-02C, the thermal vacuum outgassing test for the screening of space materials.
Why Choose Permabond ET5424?
- High shear strength
- Long open time (4 hour pot life)
- Reduced hazards SDS
- High temperature resistance following low-temperature cure
- ECSS-Q-ST-70-02C outgassing compliant
Strong Bonding Performance
| Substrate | Shear Strength, cured 23°C/5 days | Shear Strength, cured 66°C/1 hour |
|---|---|---|
| Aluminium | 22-27 N/mm² (3,190-3,916 psi) | 25-30 N/mm² (3,625-4,351 psi) |
| Mild Steel | 20-25 N/mm² (2,900-3,626 psi) | 21-26 N/mm² (3,046-3,771 psi) |
| Stainless Steel | 24-29 N/mm² (3,480-4,206 psi) | 28-32 N/mm² (4,061-4,641 psi) |
| Carbon Fibre | >20 N/mm² (>2,900 psi, substrate failure) | >23 N/mm² (>3,336 psi, substrate failure) |
Floating roller peel strength on aluminium runs 70-100 N/25mm (16-23 PIW), with a cured hardness >80 Shore D.
Built for Heat
ET5424 carries a glass transition temperature (Tg) of 182°C (360°F) and thermal conductivity of 0.46 W/(m·K). Shear strength actually improves when cured at 66°C for just one hour versus a room-temperature cure, and the bond tolerates service temperatures up to roughly 230°C and down to -55°C (-67°F).
Easy 4:1 Mixing
ET5424 mixes 4:1 by volume (100:18 by weight) through a dual cartridge and static mixing nozzle. Usable pot life runs approximately 4 hours at 23°C for a 10g mass, with working strength reached in 24 hours and full cure in 3-5 days at room temperature (or 1 hour at 66°C to accelerate).
Recommended Accessories
For the 400ml dual cartridge: Maven MV400-36X Manual Dispenser and MixPac MFQX 10-24T Static Mixing Nozzle (4:1/10:1).
How to Use
- Measure 100 parts resin to 18 parts hardener by weight, or dispense through a 4:1 dual cartridge and static mixer.
- Mix thoroughly, taking care not to entrap air. Can be applied and mixed with automated dispensing equipment.
- Clean and degrease surfaces before applying; lightly abrade metals such as aluminium or copper to remove the oxide layer.
- Apply material to one of the substrates.
- Join the parts within the usable pot life of the mixed adhesive.
- Apply pressure to the assembly by clamping until handling strength is obtained.
- Allow 3-5 days at 23°C (77°F) for full cure, or 1 hour at 66°C to accelerate curing.
- Exercise caution when mixing large quantities due to the exothermic reaction.
Typical Applications
- Aerospace structural and component bonding
- Honeycomb panel and composite assembly
- Satellite and space-hardware bonding
- Metal component assembly ahead of powder coating or paint baking
- Large-area and batch-production bonding
Product Specifications
- Mix ratio: 4:1 by volume, 100:18 by weight
- Specific gravity: 1.41 (Part A) / 1.01 (Part B)
- Maximum gap fill: 3mm (0.12 in)
- Usable/pot life @23°C: ~4 hours (10g mass)
- Working strength @23°C: 24 hours
- Full cure: 3-5 days @23°C or 1 hour @66°C
- Hardness: >80 Shore D
- Glass transition temperature (Tg): 182°C (360°F)
- Thermal conductivity: 0.46 W/(m·K)
- Service temperature range: -55°C to ~230°C (-67°F to ~446°F)
- Storage temperature: 5-25°C (41-77°F)
- ECSS-Q-ST-70-02C outgassing tested
Not recommended for use in contact with strong oxidizing materials. For professional or industrial use only.
Popular Use Cases for Permabond ET5424
Permabond ET5424 is a two-part epoxy designed primarily for the aerospace industry, offering excellent temperature resistance after a low-temperature cure. That combination makes it well suited to assemblies that go on to see a powder-coat bake or paint-curing oven after bonding.
Aerospace & Space-Hardware Bonding
ET5424 meets ECSS-Q-ST-70-02C, the thermal vacuum outgassing screening standard for space materials, and carries a reduced-hazard SDS for safer handling in production environments.
Typical applications include:
- Aerospace structural and component bonding
- Honeycomb panel and composite assembly
- Satellite and space-hardware bonding where outgassing screening is required
- Metal component assembly ahead of powder coating or paint baking
High-Temperature Service After Low-Temperature Cure
With a Tg of 182°C (360°F) and shear strength that actually improves when cured at 66°C for just one hour versus room temperature, ET5424 is built for joints that need to survive a bake cycle intact.
This supports:
- Powder-coat and paint-bake compatible assemblies
- Components exposed to sustained high-temperature service, up to roughly 230°C
- Metal fabrication where post-bond thermal processing is part of the workflow
Large Bond Areas & Batch Production
The extended pot life (4 hours at 23°C for a 10g mass) gives operators working time on large bond areas and in batch production settings where many parts are mixed and applied before any one joint sets.
Common uses include:
- Large-area structural bonding
- Batch and production-line assembly processes
- General manufacturing and metal fabrication bonding
A Purpose-Built Choice for Aerospace-Grade Thermal Bonding
Overall, ET5424 is especially useful when a job calls for a structural epoxy that cures at room temperature but performs at aerospace-grade high-temperature service, meets outgassing requirements, and gives operators a long open time for large or batch assemblies.
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Click Here to visit our Datasheet Server (TDS, SDS, Fact Sheets, Selector Guides, etc)
And especially if you are considering or comparing a few different formulas. Our datasheet server can help you download the necessary data to help u decide and keep your project going.
Click Here to visit our Datasheet Server (TDS, SDS, Fact Sheets, Selector Guides, etc)