Product Name
PERMABOND ES578 - Single-part, heat-cure Epoxy Cartridge and Starter Kit
Brief Description
PERMABOND® ES578 is a single-part, heat-cured epoxy adhesive engineered for high-performance applications. It offers excellent adhesion to a variety of substrates, including metals, ceramics, and composite materials, combined with superior thermal conductivity and robust bond strength. This product is specifically designed for environments demanding efficient heat dissipation and high resistance to temperature and chemicals.
Popular Applications & Uses
- Bonding aluminum heat sinks to ceramic headers for heat dissipation.- Bonding surface mount devices (SMDs) to printed circuit boards (PCBs).- Wire tacking within electronic devices to maintain order and neatness.- Sealing wiring harnesses to prevent moisture ingress and protect connections.- Packaging and internal sealing of microstructures such as pressure and acceleration sensors.- LED packaging and structural bonding in various lighting applications.- Encapsulating electronic transformers, inductors, and power modules to enhance electrical insulation and thermal stability.- Bonding critical components in motors, such as stators, rotors, and magnets.- Bonding and assembling composite materials and metals in aircraft structures.- Potting connectors to secure connections between electronic components and cables.
Industries that Commonly Use It
- Aerospace/Defense- Automotive Service/Repair- Chemical Industry- Electrical Services or Products- General Manufacturing- LED/Electronics- Medical Device/ Prosthetics- Metal Fabrication- Energy
Special and Unique Features
- Single-part system, eliminating the need for manual mixing, which reduces human error and streamlines production processes.- Heat-cured formulation, allowing for flexible cure schedules and efficient batch processing in industrial settings.- Exceptional thermal conductivity, making it ideal for applications requiring efficient heat dissipation.- Delivers high shear and peel strength for durable and reliable bonds.- Provides excellent resistance to vibration, ensuring long-term integrity in dynamic applications.- Offers high temperature resistance, capable of withstanding brief periods during processes like paint baking and wave soldering.- Exhibits good resistance to a wide range of chemicals, including acids, alkalis, solvents, and fuels.- Electrically insulating properties, suitable for protecting sensitive electronic components.- Designed to meet the fire retardancy requirements of UL94 V-0.- Features low shrinkage properties and excellent dimensional stability upon curing.
Key Properties
- Type: Single-part, heat-cure epoxy adhesive- Color: Black- Viscosity: Approximately 700,000 mPa·s @ 23°C (Thixotropic)- Cure Temperature: Typically 100-150°C, with some grades curing below 100°C for heat-sensitive substrates.- Operating Temperature Range: -40°C to 180°C (-40°F to 355°F)- Thermal Conductivity: Very good, approximately 1.0 W/(m.K)- Shear Strength (Mild Steel): 27-41 MPa (4,000-6,000 psi)- Shear Strength (Aluminum): 17-31 MPa (2,500-4,500 psi)- Chemical Resistance: Good resistance to various chemicals, acids, alkalis, solvents, and fuels.- Electrical Properties: Electrically insulating- Fire Retardancy: Meets UL94 V-0 requirements
Surface Compatibility
- Metal surfaces, including aluminum, mild steel, and other alloys.- Ceramics.- Composite materials.- Engineering plastics.- Glass.
Known backups / known substitutes
- Other Permabond single-part heat-cure epoxies such as ES550, ES558, ES562, ES569, and ES579.- Loctite 2018 is listed as a potential alternative for ES578.- One-component heat-cure epoxy systems from other manufacturers like Master Bond (e.g., EP3RR-1) or Kohesi Bond (e.g., KB 1613 HT, TUF 1820 HTS).- General-purpose 3M Scotch-Weld epoxies, depending on specific application requirements.
Comparison Note
PERMABOND ES578, as a single-part heat-cure epoxy, offers distinct advantages over traditional two-part epoxy systems by eliminating the need for manual mixing, which significantly reduces the potential for human error and enhances production efficiency. This pre-mixed formulation also provides an extended working life prior to heat activation. Its specialized formulation ensures excellent thermal conductivity and high-temperature resistance, making it uniquely suited for applications demanding efficient heat dissipation, a feature not commonly found in many general-purpose adhesives. Furthermore, ES578 boasts superior mechanical strength, robust chemical resistance, and exceptional dimensional stability, outperforming many other adhesive types in demanding industrial environments.
