Product Name
Permabond ES569 High Strength 1-Part Heat-Cure Thick Metal-Optimized Epoxy Cartridge and Starter Kit
Brief Description
Permabond ES569 is a high-strength, single-part, heat-cured epoxy adhesive specifically engineered for excellent adhesion to metal surfaces and composite materials. It is designed to be non-sagging, making it suitable for large gaps and vertical applications, and can effectively replace traditional mechanical fastening, soldering, brazing, or welding methods.
Popular Applications & Uses
- Replacing mechanical fasteners, soldering, brazing, or welding in various assemblies.- Bonding electronic components due to its high wet strength, non-stringing properties, and ability to withstand solder reflow processes.- Applications requiring bonding in large gaps or on vertical surfaces, thanks to its non-sagging, thixotropic nature.- Heavy wear-and-tear applications, such as bonding tungsten carbide tools and machinery.
Industries that Commonly Use It
- Aerospace/Defense- Automotive Service/Repair- Chemical Industry- Electrical Services or Products- Energy- Engineering Services- Fabrication- General Manufacturing- LED/Electronics- Marine- Metal Fabrication- Transportation/Specialty Vehicle
Special and Unique Features
- Single-part formulation, requiring no mixing, which simplifies application.- Heat-cure mechanism provides controlled curing and robust bond formation.- Non-sagging (thixotropic) properties allow for use in large gaps up to 5mm and on vertical surfaces.- High wet strength and non-stringing, producing an excellent drop profile, ideal for electronic bonding.- Withstands solder reflow processes, making it suitable for electronics manufacturing.- Excellent adhesive strength, high shear and peel strength.- Excellent resistance to vibration.- High temperature resistance, with a service temperature range of -40°C to +180°C.- Good resistance to chemicals.
Key Properties
- Chemical composition: Epoxy Resin- Appearance: Black paste- Viscosity @ 25°C: 250,000 to 500,000 mPa.s (cP)- Specific gravity: 1.2- Maximum gap fill: 5 mm (0.2 in)- Cure speed (oven): 130°C (266°F) for 75 minutes; 150°C (300°F) for 60 minutes; 170°C (338°F) for 40 minutes- Cure speed (induction): <3 minutes- Shear strength (Steel): 27 – 41 N/mm² (4000 – 6000 psi)- Temperature resistance: -40°C to +180°C (-40°F to +356°F)- Hardness (ISO868): 80-85 Shore D- Thermal conductivity: 0.9 W/(m.K)- Glass transition temperature (Tg - DSC): 120°C (250°F)
Surface Compatibility
- Metals: Excellent adhesion to mild steel, aluminum, zinc, copper, brass, cast iron, and stainless steel.- Composite materials: Bonds well to various composites, including FRP Glass/Epoxy.- Electronic components.- Surface preparation: Surfaces should be clean, dry, and grease-free. Degreasing with solvents like acetone or isopropanol is recommended. Light abrasion may benefit some metals like aluminum and copper alloys to remove oxide layers.
Known backups / known substitutes
- Permabond ES550- Permabond ES558- 3M 2214 Hi-Temp New Formula Gray- HB Fuller MP5401
Comparison Note
Permabond ES569 stands out as a high-performance, single-part heat-cure epoxy, offering significant advantages over traditional two-part systems by eliminating the need for mixing, thus simplifying application and reducing potential errors. Its non-sagging, thixotropic nature allows for robust bonding in challenging geometries and vertical applications, while its high strength and resistance to temperature and chemicals make it a reliable alternative to mechanical fasteners, welding, and brazing, particularly for metal and electronic component bonding.
