Loctite EA (Hysol) D609 Moisture & Chemical-Resistant 5-Min Seting Epoxy

Loctite EA (Hysol)

SKU: EXP_LT_D609_50ML

  • $ 6.60
    (We can use your FedEx/UPS acct: Type-in the needed Acct # & Service Level)


    LOCTITE EA (Hysol) D609 is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where fast curing is required. This ultra clear, two part, low viscosity system mixes easily at room temperature. It is suitable for high performance structural bonding applications requiring a combination of very fast room temperature cure, low shrinkage, and excellent mechanical properties. Fully cured EA (Hysol) D609 is an excellent electrical insulator and provides superior resistance to vapors and gases, water, galvanic action, petroleum fuels, salt solution and many other organic and inorganic compounds.  

    Recommended Substrates

    metals, phenolic plastics, polyester, glass and glass fabrics, hardboards and forestry products, ceramics, rubber, masonry materials and other construction materials.

    Features

    • Very Fast Room Temperature
    • No Solvents
    • Easy to Mix
    • Very Clear
    • Self Leveling

    Data Sheets (Click on a link)

        TDS / Technical Data Sheet

        MSDS Parts A & B

    Typical Uncured Properties

    PartA

    PartB

    Mixed

    Pot Life @ 77°F, 20 grams mins

    --

    --

    5

    Color

    Clear

    Clear

    Clear

    Viscosity, cP

    11,000 to

    19,000

    11,000 to

    19,000

    N/A

    MixRatio

     

     

     

    By weight

    1

    1

     

    Byvolume

    1

    1

     

     

    Typical Properties

    Typical Value

    Tensile Strength, psi, ASTM D 638

    4200

    Hardness, Shore D

    75

     

    Electrical Properties

    Typical Value

    Dielectric Strength, ASTM D149, V/mil

    415

     

    Shear Strength, psi, ASTM D 1002 Etched Aluminum

    Test Temp oF

    Typical Value

     

    77

    1800

     

     

    Handling

    Mixing:Thisproductrequiresmixingtwocomponentstogetherjustpriortoapplication.Completemixingisnecessary.Thetemperatureoftheseparatecomponentspriortomixingisnotcritical,buttheyshouldbeclosetoroomtemperature.

     

    Application

    Bonding surfaces should be clean and dry.Once the adhesive is applied, the bonded parts should be held in contact until the part has developed handling strength. It is not necessary to clamp the parts unless movement during cure is likely.

    Mixing - Cartridges: Place cartridge in proper dispenser. To begin using a new cartridge, remove the cap and dispense a small amount of adhesive, making sure both parts A & B are extruding. Attach nozzle and dispense approximately  1-2" before applying onto the part to be bonded. Partially used cartridges should be stored with the mixing nozzle attached. To reuse, remove and discard the old nozzle, attach the new nozzle, and begin dispensing.

    Mixing - Bulk: Combine Part A (resin) and Part B (hardener) in the correct ratio (1:1) and mix thoroughly until the color and consistency are uniform. Ratios given above can be used for measuring larger amounts. Mixing the adhesive just prior to use is recommended. Heat buildup during or after mixing is normal. Do not mix quantities greater than 1/2 pound as dangerous heat buildup can occur causing uncontrolled decomposition of the mixed adhesive. Mixing smaller quantities will minimize the heat buildup.

     

    Cure

    Complete cure is obtained after 24 hours at 77°F. EA (Hysol) D609 will achieve handling strength after 10 minutes at 77°F (note: this can vary with different bond configurations).

     

    Clean Up

    It is important to remove excess adhesive from the work area and application equipment before it hardens. Many common solvents and citrus cleaners are suitable for removing uncured adhesive. Consult with your supplier's information pertaining to the safe and proper use of solvents.

     

    Packaging

    • 50 ml EPS Cartridges
    • 200 ml EPS Cartridges
    • Gallon Systems
    • Five Gallon Systems

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