LOCTITE 620 High-Temperature Retaining Compound – Up to 450°F
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$ 25.99 USD
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High-temperature retaining compound for cylindrical assemblies
LOCTITE® 620 is a green, one-part anaerobic retaining compound formulated for bonding close-fitting cylindrical metal parts where high strength and elevated-temperature resistance are required. It cures between active metal surfaces when air is excluded, helping secure bearings, bushings, sleeves, locating pins, and similar assemblies.
Key benefits
- High-strength retention for cylindrical metal parts
- Service temperature range: -65°F to 450°F (-55°C to 230°C)
- Typical fixture time: 60 minutes on steel; cure rate varies by substrate, gap, temperature, and activator use
- Fills diametral gaps approximately 0.006–0.010 in. (0.15–0.25 mm)
- High-viscosity liquid helps application to fitted components
- DVGW approval to EN 751-1 (NG-5146AR0622)
Common applications
- Locating pins in radiator assemblies
- Sleeves in pump housings
- Bearings in automotive and industrial transmissions
- Bushings, collars, and other close-fitting cylindrical metal components
Technical details
- Chemistry: methacrylate ester acrylic
- Appearance: green liquid
- Components: one part
- Cure: anaerobic
- Viscosity: approximately 8,500 cP at 77°F (25°C)
- Specific gravity: approximately 1.16 at 73°F (23°C)
- Typical steel shear strength after 24 hours at 73°F: 2,500 psi (17 N/mm²), ISO 10123
- Full cure: typically 24 hours under suitable conditions
Application guidance
For best results, clean and degrease mating surfaces. Apply enough product to fill the joint and assemble promptly. For passive metals, large gaps, low temperatures, or slow cure conditions, use LOCTITE® SF 7649 activator according to its instructions. Allow the assembly to reach handling strength before loading and full cure before maximum service.
Important limitations
Not recommended for pure oxygen or oxygen-rich systems, chlorine, or other strong oxidizers. It is not normally recommended for plastics, particularly thermoplastics that may stress-crack. Confirm substrate compatibility and performance under actual service conditions.