Insulcast I-Bond 5-171-1 Epoxy Potting Compound
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Regular price
$ 7,400.25 USD
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Insulcast I-Bond 5-171-1 is a epoxy potting compound that protects your electronics from heat, moisture, and vibration. Pour or pump it around the assembly and it cures to a tough, protective mass that keeps the finished part working in the field. Sold in multiple sizes and, where the system is two-part, in matched Part A and Part B.
Features
- Seals out moisture, dust, and contaminants
- Cushions components against shock and vibration
- Strong dielectric protection for reliable electrical isolation
- Backed by ITW Performance Polymers
Intended Uses
- Potting power supplies, transformers, and coils
- Sealing sensors, connectors, and control modules
- Protecting LED and lighting electronics
- Encapsulating medical device electronics
- EV and e-mobility power electronics
Physical Properties
- Mix ratio (by weight): 90:80
- Viscosity (Part A): 1,800 cP
- Pot life (25C): 1-2 hr (gel 4-6 hr)
- Cure: 48 hr @25C or 3 hr @77C
- Hardness: Shore A 80-90
- Service temp: -55 to 150 C
Mix Ratio and Cure
Mix Part A and Part B at 90:80 by weight. Cure: 48 hr @25C or 3 hr @77C. Degas under vacuum for a void-free pot in critical assemblies.
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