Epibond 315M Conductive Epoxy, infused with MIRALON Carbon Nanotube Technology

Product Overview

Epibond® 315M is a high-performance two-part electrically conductive epoxy adhesive infused with MIRALON® carbon nanotube technology. Designed for advanced structural bonding applications, Epibond 315M delivers conductive performance, static dissipation, and strong adhesion to composites, metals, and dissimilar substrates while avoiding the weight penalties associated with traditional metal-filled conductive adhesives.

It is engineered for demanding industrial and aerospace applications. Formulated with MIRALON® carbon nanotube technology, at around a 2% concentration, it delivers excellent electrical conductivity for ESD-sensitive environments while maintaining exceptionally strong structural bonding across a wide range of substrates.

Designed for metals, composites, and dissimilar materials, this adhesive offers reliable performance under elevated temperatures and harsh operating conditions.

Key Features

• Infused with Huntsman MIRALON® carbon nanotube technology
• Electrically conductive structural epoxy adhesive
• Designed for ESD/static dissipation applications
• Bonds composites, metals, and dissimilar materials
• Lightweight CNT-based alternative to traditional metal-filled conductive adhesives
• High strength bonding (lap shear & compressive)
• Bonds metals, composites, and mixed substrates
• Room temperature or heat cure options
• Service temperature up to 400°F (204°C)
• Contains 0.005” spacer beads for bondline control
• Low outgassing (meets NASA ASTM E595 standards)

What is MIRALON® Carbon Nanotube Technology anyway?

Check out the Miralon Category page for more info also

MIRALON® technology from Huntsman incorporates advanced carbon nanotube (CNT) structures into epoxy systems to create conductive pathways while maintaining strong mechanical properties and reduced material weight.

Unlike traditional conductive adhesives that rely heavily on metallic fillers such as silver or nickel, MIRALON-infused systems utilize carbon nanotube networks to support electrical conductivity, ESD dissipation, and composite reinforcement with lower filler loading and reduced density.

In Epibond® 315M, MIRALON technology helps provide a balance of conductive performance, structural bonding capability, and lightweight material design for demanding aerospace, electronics, composites, and industrial applications.

Why Use a Carbon Nanotube (CNT) Infused Conductive Adhesive?

Carbon nanotube conductive adhesives offer an alternative to traditional metal-filled conductive systems by utilizing CNT networks to achieve conductive and dissipative properties with lower material density.

Advantages of CNT Adhesives:

• Reduced weight
• Improved toughness and crack resistance
• Better compatibility with composite structures
• Reduced metallic filler loading
• Static dissipation capability
• Electrically conductive bonding performance
• Potential EMI shielding support

Typical Applications

• Aerospace & defense assemblies
• Electronics & ESD-sensitive components
• Structural bonding of metals and composites
• High-temperature industrial assemblies

Product Specifications

Processing Properties

• Mix Ratio:
• 100:61 (by weight)
• 2:1 (by volume)
• Working Time (77°F / 25°C): 70 minutes
• Gel Time (77°F / 25°C): 100 minutes
• Cure Options:
• 5–7 days at room temperature
• Accelerated cures available (150°F–300°F schedules)

Mechanical & Electrical Properties

• Lap Shear Strength: 5,200 psi (Aluminum, ASTM D1002)
• Thick Adherend Lap Shear: 6,000 psi
• Electrical Resistance: < 1 × 10⁵ Ω
• Glass Transition Temperature (Tg): 150–175°C

Physical Properties

• Color (Mixed): Dark Gray
• Form: Paste
• Density (Resin A): ~1.2 g/cm³

Storage & Shelf Life

• Store sealed in a dry environment
• Shelf Life:
• 24 months (36°F–77°F / 2–25°C)
• 12 months (64°F–104°F / 18–40°C)

Components Included

• Part A: Epoxy Resin
• Part B: Hardener

Safety & Handling

• Causes skin and eye irritation; may cause allergic reactions
• Use proper PPE (gloves, eye protection, protective clothing)
• Avoid inhalation and contact with skin/eyes
• For full safety details, review SDS documents:

Why Choose EPIBOND® 315M?

This adhesive combines electrical conductivity + structural strength, making it ideal for applications where both mechanical integrity and ESD performance are critical. Its flexible cure schedules and high-temperature resistance make it a versatile solution across industries.

Important Notes

• For professional and industrial use only
• Always test suitability for your specific application
• Follow all handling and curing guidelines for optimal results