Devcon 5-Minute Epoxy Gel - Fast Setting Thixotropic (no-drip) Epoxy

Devcon

SKU: DV5G_14265_50ML

  • $ 184.79
    (We can use your FedEx/UPS acct: Type-in the needed Acct # & Service Level)


    Devcon 5-Minute Epoxy Gel is popular in industrial, professional, and Do-It-Yourself applications.

    P/N's: 14240 is the 25ml syringe, and 14265 is the 50ml cartridge

    It is a fast-curing, thixotropic, non-migrating adhesive designed for filling gaps and bonding rough or smooth surfaces. The disappearing blue coloring tells you when the product is thoroughly mixed and ready to apply. It’s a general-purpose adhesive/encapsulant which easily dispenses and mixes in seconds, dries in 15 minutes and reaches functional strength in 1 hour. 

     

    KEY FEATURES:

    • Bonds rigid durable substrates such as metals, glass, ceramics, concrete and wood in all combinations
    • High tensile strength (2,500 psi)
    • Good solvent resistance to gas, oil and other solvents
    • Non-Sag (No-Drip) which makes it ideal for use on walls and vertical surfaces
    • Excellent gap filling qualities without tremendous shrinkage Fast curing for bond tags on machinery and equipment
    • Functional strength in 1 hour
    • 100% reactive, no solvents

    Intended Uses:

    • Bonds metals, fabrics, ceramics, glass, wood, and concrete (and in combinations)
    • Aluminum, Brass, Cast Iron, Copper, Stainless Steel, Carbon Steel & Ferrites, Epoxies, PVC & Vinyls, Woods, Plywoods & Laminates, Particle Boards, Brick, Concrete, Ceramics
    • Popular for filling voids and potting/filler compounds
    • Excellent for bonding to walls and vertical surfaces, and for filling gaps and voids

    Physical Properties:

    Cured 7 days @ 75° F     

    Adhesive Tensile Lap Shear[GBS]    2,500 psi @ 0.010" bondline

    Dielectric Strength                         440 volts/mils

    Gap Fill                                         Excellent

    Impact Resistance                         6.5 ft.lb./in(2)

    Service Temperature                     -40°F to 200°F

    Shore Hardness                             80 Shore D

    Solids by Volume                          100

    Specific Volume                            23.7 in[3]/lb.

    Tensile Elongation                         5%

    Tpeel                                           2-3 pli

    TESTS CONDUCTED

    Adhesive Tensile Shear ASTM D 1002 Cured Density ASTM D 792

    Dielectric Strength, volts/mil ASTM D 149 Compressive Strength ASTM D 695 Cured Hardness Shore D ASTM D 2240

    Uncured                             

    Color                                          Opaque / White-ish

    Fixture Time                               10-15 min. @ 72°F

    Full Cure                                    48 hrs.

    Functional Cure                          1.5 hrs. @ 72°F

    Mix Ratio by Volume                   1:1

    Mix Ratio by Weight                    1:1

    Mixed Density                            9.75 lbs/gal.: 1.17 gm/cc

    Mixed Viscosity                          Gel / Thixotropic

    Working Time                            4-7 min. [28 gm @ 72°F]

    SurfacePreparation:

    Clean surface by solvent-wiping any deposits of heavy grease, oil, dirt, or other contaminants. Surface can also be cleaned with industrial cleaning equipment such as vapor phase degreasers or hot aqueous baths. If working with metal, abrade or roughen the surface to significantly increase the microscopic bond area and increase the bond strength.

    Mixing Instructions: 

    Proper homogenous mixing of resin and hardener is essential for the curing and development of stated strengths. ----

    25 ML DEV-TUBE

    1.  Squeeze material into a small container the size of an ashtray.
    2.  Using mixing stick included on Dev-tube handle, vigorously mix components for one (1) minute.
    3.  Immediately apply to substrate.

    50 ML/400ML/490 ML CARTRIDGES

    1.  Attach cartridge to Mark V ™ [50ml] 400ml manual or pneumatic dispensing systems.2.  Open tip.
    3.  Burp cartridge by squeezing out some material until both sides are uniform (ensures no air bubbles are present during mixing).
    4.  Attach mix nozzle to end of cartridge.

    5.  Apply to substrate.

    Application Instructions:

    1.  Apply mixed epoxy directly to one surface in an even film or as a bead.

    2.  Assemble with mating part within recommended working time.
    3.  Apply firm pressure between mating parts to minimize any gap and ensure good contact (a small fillet of epoxy should flow out the edges to display adequate gap fill.)

    For very large gaps:

    1.  Apply epoxy to both surfaces

    2.  Spread to cover entire area OR make a bead pattern to allow flow throughout the joint Let bonded assemblies stand for recommended functional cure time prior to handling.

    Chemical Resistance:

    Chemical resistance is calculated with a 7 day, room temp. cure (30 days immersion) @ 75°F)

    Acetic (Dilute) 10%

    Poor

    Acetone

    Poor

    Ammonia

    Poor

    CornOil

    Excellent

    CuttingOil

    Excellent

    Ethanol

    Poor

    Gasoline(Unleaded)

    Excellent

    Glycols/Antifreeze

    Fair

     

     

    Hydrochloric10%

    Poor

    Isopropanol

    Poor

    Kerosene

    Excellent

    MethylEthylKetone

    Poor

    MineralSpirits

    Excellent

    MotorOil

    Excellent

    SodiumHydroxide10%

    Poor

    Sulfuric10%

    Poor

     

     

    Precautions:

     Please refer to the appropriate material safety data sheet (MSDS) prior to using this product.

    For technical assistance, please call 1-800-933-8266 

    FORINDUSTRIAL USE ONLY


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