ASI 5900 Fast Grab Hybrid Construction Adhesive - Immediate Green Strength
Need Datasheets? Need Accessories?
• Click Here to visit our Datasheet Server (TDS, SDS, Fact Sheets, Selector Guides, etc)• Check out Popular Accessories below by scrolling down just a bit on this page.
Regular price
$ 5.99 USD
Call for ETA
ASI 5900 Fast Grab Hybrid Adhesive is a one-part, gun-grade construction adhesive that develops immediate green strength to hold materials in place while it cures. Its 100% solids, solvent-free and isocyanate-free hybrid formula will not shrink, remains flexible after cure, and can bond a broad range of construction and industrial substrates—including damp surfaces where moisture is present.
Key Benefits
- Immediate grab: Develops green strength right away to reduce bracing, temporary fasteners, and assembly time.
- Wet-surface capability: Can cure on wet substrates or when moisture is present without the wash-off associated with water-based products.
- No shrinkage: The 100% solids formula contains no solvent or water to flash off during cure.
- Flexible, durable bond: Accommodates vibration and movement in construction, transportation, and manufactured assemblies.
- Broad substrate range: Documented substrates include ceramics, fiberglass, glass, granite, marble, wood, stone, EPDM, aluminum, galvanized metal, EPS foam, porcelain, PVC, other plastics, concrete, and brick.
- Consistent application: Gun-grade, non-slump material remains easy to dispense across a wide temperature range.
Product Specifications
| Product | ASI 5900 Fast Grab Hybrid Adhesive |
|---|---|
| Chemistry | One-part hybrid adhesive; 100% solids; solvent-free and isocyanate-free |
| Color | Natural white |
| Viscosity | 2,100,000 cP (ASI test method; spindle 7 at 4 rpm) |
| Consistency | Gun grade; passes non-slump testing |
| Mix ratio | One part; no mixing or additives required |
| Gap fill | No maximum gap-fill dimension stated in the TDS |
| Fixture / green strength | Immediate green strength; no numerical fixture time stated |
| Skin formation | 10 minutes at 70°F (21°C) and 50% relative humidity |
| Cure | Moisture cure; 13 mm (0.51 in) cure depth after 7 days at 70°F (21°C) and 50% RH. Strength continues developing for 7 days. |
| Full cure | No single full-cure time stated; bead size, confinement, temperature, and humidity affect cure |
| Lap-shear strength | 2.15 MPa (approximately 312 psi), ASTM D412 as listed in the TDS |
| Tensile strength | 1.58 MPa (approximately 229 psi), ASTM D412 |
| Hardness | 45 Shore A, ASTM C661 |
| 100% modulus | 1.42 MPa (approximately 206 psi) |
| Elongation at break | 150% |
| Density | 14.8 lb/gal (approximately 1.77 g/cm³) in the TDS; SDS reports 15.01 lb/gal |
| Service temperature | -50°F to 220°F (-46°C to 104°C); intermittent exposure up to 270°F (132°C) |
| Suggested application temperature | 32°F to 150°F (0°C to 66°C); colder conditions slow cure |
| VOC content | 9.55 g/L, ASTM D2369 |
| Weathering test | Pass, ASTM G154, 10,000 hours |
| Documented shelf life | 12 months from shipment for cartridges stored at 70°F (21°C) and 50% RH; high temperature and humidity can significantly shorten shelf life |
| Available sizes | 10 oz tube and 20 oz tube |
Performance values are typical and should not be used as guaranteed design specifications. Test adhesion and strength on the actual substrate and in the intended environment after allowing seven days for maximum strength development.
Directions for Use
- Make sure surfaces are clean and free of oils, dust, and other contaminants. Although ASI 5900 can cure in the presence of moisture, cleaning is still required.
- Where compatible with the substrate, clean with 100% isopropyl alcohol or acetone. Do not use petroleum-based solvents.
- Cut the nozzle to the desired bead size, load the package into the appropriate dispensing gun, and apply directly. No mixing or additives are required.
- Join and position the materials while the adhesive is workable. Apply enough material for continuous contact and proper joint coverage.
- Tool the bead before skin formation, typically within 10 minutes at 70°F (21°C) and 50% RH.
- Allow the bond to cure. Higher temperature and humidity accelerate cure; cold and dry conditions slow it. Allow seven days before evaluating maximum adhesion or strength.
Wet adhesive can be cleaned with ASI 0240 Adhesive Remover & Cleaner. Cured material generally requires scraping or abrasion. Test all substrates before production use. Olefins such as polyethylene, polypropylene, and TPO require testing, and prolonged underwater submersion can reduce adhesion on some substrates.
Storage and Handling
Keep the package tightly closed in a cool, dry, well-ventilated place. For cartridges, the TDS lists a 12-month shelf life from shipment when stored at 70°F (21°C) and 50% RH. Avoid elevated temperature and humidity. Wear suitable gloves and safety glasses, avoid eye and skin contact, and review the SDS before use. The SDS lists ASI 5900 as not regulated for transport by DOT, IATA, or IMDG.