Product Name
3M Scotch-Weld DP270 Clear 60-Minute Electric & Thermal Resistant Epoxy
Brief Description
3M Scotch-Weld DP270 Clear is a two-part, low viscosity epoxy resin system primarily designed for potting, sealing, and encapsulation of sensitive electronic and electrical components. It offers excellent electrical insulation properties, good thermal shock resistance, and is non-corrosive to copper.
Popular Applications & Uses
- Potting and encapsulation of heat-sensitive components such as glass diodes and sensors.- Potting transformers, coils, chokes, and relays.- Bonding electronic and electrical components.- General structural bonding applications where high strength and environmental resistance are required.
Industries that Commonly Use It
- Electrical Services or Products- LED/Electronics- General Manufacturing- Aerospace/Defense- Transportation/ Specialty Vehicle- Medical Device/ Prosthetics (due to good resistance to medical sterilization)- Engineering Services (for design and specification of electronic assemblies)
Special and Unique Features
- Non-corrosive to copper, preserving conductivity and insulation properties.- Minimal exotherm, protecting temperature-sensitive materials during the potting process.- Very low shrinkage, minimizing stress on potted components during cure.- Meets UL 94 HB flammability standards for added safety.- Long work life of 60-70 minutes, allowing for precise application and adjustments.
Key Properties
- Adhesive Type: Two-part Epoxy/Amine- Color: Clear (also available in black)- Mix Ratio (by volume): 1:1 (Base:Accelerator)- Viscosity (Base): 7,000 - 16,000 cps @ 23°C (73°F)- Viscosity (Accelerator): 6,000 - 12,000 cps @ 23°C (73°F)- Work Life: 60-70 minutes @ 23°C (73°F)- Tack-Free Time: Approximately 3 hours- Time to Handling Strength: Approximately 3 hours- Full Cure: 48 hours @ 23°C (73°F)- Shore D Hardness: 83- Shear Strength: 2,500 psi- Storage Temperature: 60°F to 80°F (16°C to 27°C)
Surface Compatibility
- Bonds well to a variety of substrates including wood, metal, glass, stone, and various plastics.- For high-strength structural bonds, surfaces must be thoroughly cleaned of contaminants like paint, oxide films, oils, dust, and mold release agents.- Specific surface preparations may include alkaline degrease and acid etch for aluminum, and solvent wipe with primer for glass.
Known backups / known substitutes
- 3M™ Scotch-Weld™ Epoxy Potting Compound/Adhesive 270 B/A (bulk container equivalent)- Other 3M Scotch-Weld DP270 variants, such as the black formulation.- General two-part epoxy potting compounds or structural epoxy adhesives from other manufacturers, chosen based on similar electrical, thermal, and mechanical properties, and application requirements.
Comparison Note
3M Scotch-Weld DP270 stands out among structural adhesives for its specialized formulation tailored for sensitive electronic and electrical components. While epoxy adhesives generally offer superior overall strength, heat, chemical, and outdoor weathering resistance compared to other structural adhesives like polyurethane, acrylic, and cyanoacrylate, DP270 specifically excels with its low viscosity for easy potting, non-corrosiveness to copper, minimal exotherm, and very low shrinkage, making it particularly suitable for delicate assemblies.
