Permabond ET5441 Thermally Conductive 2-Part Epoxy, High-Temperature Metal Bonding Adhesive
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SKU:
PBND_ET5441_050ML
Regular price
$46.00 CAD
Currently Out of Stock
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SKU
- Type Epoxy
- Vendor Permabond
- SKU PBND_ET5441_050ML
Permabond ET5441 is a thixotropic, thermally conductive two-part epoxy built for bonding metal parts that run hot. It reaches full cure in 7 days at room temperature, or in 24 hours at room temperature followed by 30 minutes at 80°C (176°F). Cured bonds hold up well against motor oil, glycol, and hot or cold water.
Why Choose Permabond ET5441?
- Thermally conductive: 1.1 W/(m·K)
- High-temperature resistant: service from -55°C (-67°F), with brief exposure up to 200°C (392°F)
- 2:1 mix ratio by weight and volume
- Room temperature cure, with a faster heat-accelerated option
- Chemical resistance to motor oil, glycol, and hot or cold water
- UL94 HB flammability rating
- Meets ECSS-Q-ST-70-02C thermal vacuum outgassing screening for space materials
- Supplied in 50ml and 400ml dual cartridges
Bond Strength
| Substrate | Shear Strength (ISO 4587) |
|---|---|
| Steel | 20 to 25 N/mm² (2,900 to 3,625 psi) |
| Stainless Steel | 20 to 25 N/mm² (2,900 to 3,625 psi) |
| Aluminum | 17 to 21 N/mm² (2,465 to 3,045 psi) |
| Carbon Fiber | 25 to 30 N/mm² (3,625 to 4,350 psi) |
| FRP (Glass/Epoxy) | >19 N/mm² (>2,755 psi)* |
| GRP (Glass/Polyester) | >10 N/mm² (>1,450 psi)* |
| PBT, 50% Glass Filled | 4 to 6 N/mm² (580 to 870 psi) |
| Polycarbonate | 2 to 4 N/mm² (290 to 580 psi) |
| ABS | >6 N/mm² (>870 psi)* |
*Substrate failed before the bond. Tensile strength at break (DIN 53504): 50 N/mm² (7,250 psi). Elongation at break: 2.9%. Hardness (ISO 868): 85 to 95 Shore D. Actual bond strength varies with substrate, joint design, gap and surface prep.
Built for Heat
- Thermal conductivity: 1.1 W/(m·K), so heat moves away from bonded components instead of building up at the joint
- Glass transition temperature (Tg): 65°C (149°F) after 7 days at 23°C. Rises to 113°C (235°F) with 24 hours at room temperature plus 30 minutes at 80°C.
- Coefficient of thermal expansion: 23 × 10⁻⁶/K below Tg, 111 × 10⁻⁶/K above Tg
- Hot strength: keeps 100% of room-temperature strength at 80°C (108 to 126% depending on cure schedule), 41 to 44% at 150°C, and 30 to 31% at 200°C
- Handles brief excursions to higher temperatures, such as paint baking or wave soldering, if the joint is not under heavy stress
Working Times at 23°C (73°F)
- Pot life: 150 minutes
- Working strength: 8 hours
- Full cure: 7 days
Heat speeds the cure a lot. At 80°C (176°F), full cure takes about 2 hours. ET5441 is thick (250,000 cP / 200,000 cP at 23°C), so cold 50ml cartridges can be hard to push. Warm the cartridges before dispensing through a mixing nozzle.
Recommended Accessories
For 50ml Cartridges
Maven DMA50 Manual Dispenser
A hand-operated dispenser for 50ml dual cartridges. Good for repairs, occasional use and smaller bonding jobs.
MIXPAC MBQ 05-24L Static Mixing Nozzle
Mixes the two components as they leave the cartridge for a consistent bead every time.
For 400ml Cartridges
Maven MV400-36X Manual Dispenser
A heavy-duty manual dispenser for 400ml dual cartridges. Suited to production, maintenance and fabrication work.
MIXPAC MFQ 10-24T Static Mixing Nozzle
The recommended mixing nozzle for the 400ml cartridge.
How to Use
- Make sure bonding surfaces are clean, dry and free from grease. Degrease with acetone or isopropanol.
- Lightly abrade aluminum, copper and copper alloys with emery cloth to remove the oxide layer.
- Load the dual cartridge into the dispenser and guide the plunger into the cartridge.
- Remove the cap and dispense until both components flow evenly.
- Attach the static mixing nozzle and start dispensing.
- Apply to one surface and join the parts within the 150-minute pot life.
- Clamp the assembly until handling strength is reached, about 8 hours at 23°C.
- Allow 7 days at room temperature for full cure, or speed it up with 2 hours at 80°C (176°F).
Mix large quantities with care. The reaction gives off heat. These directions follow Permabond's current ET5441 technical datasheet.
Typical Applications
- Heatsink and thermal-management component bonding
- Electronic component potting and encapsulation
- Heat exchanger assembly
- Motor and electrical component bonding
- Aerospace and space-hardware assemblies that require outgassing compliance
- Metal parts that go through paint baking or wave soldering
- General high-temperature structural metal bonding
Our Shelf Life Options
- Fresh Batch: our newest stock, with the most shelf life remaining.
- Short Shelf Life: 1 to 3 months left before the expiration date. Good value if you will use it soon.
- Recently Expired: past the printed date and sold as-is at a deep discount. Best for testing, prototypes and non-critical work. Run a test bond before relying on it.
Product Specifications
Product: Permabond ET5441
Adhesive type: Two-part epoxy (thixotropic)
Mix ratio: 2:1 by weight and volume
Part A: White epoxy resin
Part B: Dark gray amine hardener
Specific gravity: 2.1 (both parts)
Maximum gap fill: 2 mm (0.08 in.)
Pot life: 150 minutes at 23°C
Working strength: 8 hours at 23°C
Full cure: 7 days at 23°C, or 2 hours at 80°C
Thermal conductivity: 1.1 W/(m·K)
Flammability: UL94 HB
Outgassing: ECSS-Q-ST-70-02C (space material screening)
Storage temperature: 5 to 25°C (41 to 77°F)
For professional and industrial use. Keep away from strong oxidizing materials. Refer to the Safety Data Sheet for handling guidance.
Popular Use Cases for Permabond ET5441
Permabond ET5441 is a thermally conductive, high-temperature two-part epoxy built for bonding metal parts where heat has to be moved, not just tolerated. Its thixotropic consistency keeps it in place during assembly, and the 2:1 mix ratio by weight and volume dispenses cleanly through dual cartridges and static mixing nozzles.
Heatsink & Thermal Management Bonding
With thermal conductivity of 1.1 W/(m·K), ET5441 moves heat away from a joint instead of letting it build up there.
Typical applications include:
- Heatsink attachment to housings or circuit boards
- Thermal interface bonding between metal components
- Heat exchanger assembly
- Assemblies where both bond strength and heat dissipation matter
Electronics Potting & Encapsulation
Room-temperature cure and thermal performance make ET5441 a fit for protecting and bonding electronic components that generate heat or see heat in service.
Common uses include:
- Potting and encapsulating electronic assemblies
- Motor and electrical component bonding
- Securing components that go through paint baking or wave soldering
Aerospace & Space-Hardware Assemblies
ET5441 meets ECSS-Q-ST-70-02C, the thermal vacuum outgassing screening standard for space materials, and carries a UL94 HB flammability rating.
That makes it a candidate for:
- Aerospace and defense component bonding
- Satellite and space hardware where outgassing screening is required
- Applications where a flammability rating is part of the spec
Metal Fabrication & High-Temperature Process Applications
Permabond reports shear strengths of 20 to 25 N/mm² (2,900 to 3,625 psi) on steel and stainless steel and 17 to 21 N/mm² (2,465 to 3,045 psi) on aluminum, with 85 to 95 Shore D hardness once fully cured. It also handles brief exposure to paint baking or wave soldering heat if the joint is not under heavy stress.
This supports:
- Metal bracket, housing and fixture bonding
- Carbon fiber and composite bonding
- Structural metal assemblies exposed to process heat
- Equipment exposed to motor oil, glycol, and hot or cold water
A Strong Pick for Demanding Thermal Bonding Jobs
Choose ET5441 when a job needs a structural, thermally conductive epoxy that handles high-temperature service, resists common automotive and industrial fluids, and meets aerospace outgassing requirements, all with a full cure at room temperature.
Visit our datasheet server to download a variety of documents for this formula, as well as for all other formulas and products that Perigee Direct carries.
And especially if you are considering or comparing a few different formulas. Our datasheet server can help you download the necessary data to help u decide and keep your project going.
Click Here to visit our Datasheet Server (TDS, SDS, Fact Sheets, Selector Guides, etc)
And especially if you are considering or comparing a few different formulas. Our datasheet server can help you download the necessary data to help u decide and keep your project going.
Click Here to visit our Datasheet Server (TDS, SDS, Fact Sheets, Selector Guides, etc)