3M Scotch-Weld DP270 is a two-part epoxy potting compound and adhesive specifically designed for electronic applications. It cures at room temperature to a rigid, black solid that provides excellent electrical insulation and good thermal conductivity. The 60-minute work life and low viscosity allow the epoxy to flow and thoroughly encapsulate components, protecting them from moisture, shock, and thermal stress while helping to dissipate heat.
Popular Applications & Uses
- Potting and encapsulating electronic components such as sensors, connectors, coils, and power supplies.
- Sealing and protecting circuit boards from harsh environments.
- Providing high-voltage insulation between components.
- Any application where heat needs to be drawn away from a sensitive electronic part.
- Reinforcing and securing components against vibration and physical impact.
Industries that Commonly Use It
- Electronics and Semiconductor Manufacturing
- Automotive Electronics
- Aerospace and Defense
- Telecommunications
- Industrial Controls and Automation
Special and Unique Features
- Excellent electrical insulation properties, with high dielectric strength to prevent arcing and short circuits.
- Good thermal conductivity helps dissipate heat, improving the longevity and reliability of electronic components.
- Long 60-minute work life allows for complete flow and penetration into complex assemblies, minimizing voids.
- Low viscosity ensures easy pouring and complete encapsulation.
- Cures to a rigid material with excellent resistance to moisture, chemicals, and mechanical shock.
Key Properties
- Base: Epoxy
- Color: Black
- Mix Ratio: 1:1 by volume
- Work Life: 60-70 minutes at 73 F (23 C)
- Dielectric Strength: 400 V/mil
- Thermal Conductivity: ~0.30 W/m-K
- Hardness: 80 Shore D
Materials Bonded
- Primarily used as a potting/encapsulating material, but adheres well to:
- FR-4 circuit boards
- Metals (Aluminum, Copper)
- Plastics (ABS, PC)
- Glass and Ceramics
Cure Information
- Mix Ratio: 1:1 by volume
- Work Life (Pot Life): 60-70 minutes
- Time to Handling Strength: Approximately 2-4 hours at room temperature.
- Full Cure: 7 days at room temperature.
- Cure can be significantly accelerated with heat (e.g., 2 hours at 150 F / 65 C).
Known backups / known substitutes for this product
- MG Chemicals 832B Thermally Conductive Potting Compound
- Loctite E-60NC Potting Compound
Comparison Note
- 3M DP270 is a specialty electronics epoxy. Unlike general-purpose adhesives, its key features are its certified electrical insulation (dielectric strength) and heat dissipation (thermal conductivity) properties. It is chosen specifically to protect and improve the performance of electronics. Competitors like MG Chemicals 832B and Loctite E-60NC offer similar functionality as black, thermally conductive, electrically insulating potting compounds, with variations in viscosity, cure speed, and specific performance ratings.
