Devcon 5-Minute Epoxy Gel - Fast Setting Thixotropic (no-drip) Epoxy

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SKU: DV5G_14265_050ML
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Regular price $51.00 AUD
53 units available
53 units are available

Devcon 5-Minute Epoxy Gel - Fast Setting Thixotropic (no-drip) Epoxy

Devcon 5-Minute Epoxy Gel is popular in industrial, professional, and Do-It-Yourself applications.

P/N's: 14240 is the 25ml syringe, and 14265 is the 50ml cartridge

It is a fast-curing, thixotropic, non-migrating adhesive designed for filling gaps and bonding rough or smooth surfaces. The disappearing blue coloring tells you when the product is thoroughly mixed and ready to apply. It’s a general-purpose adhesive/encapsulant which easily dispenses and mixes in seconds, dries in 15 minutes and reaches functional strength in 1 hour.

Substitute and Similar Formulas::

  • Huntsman 2010-1 (thixotropic gel 5-minute)
  • Maven EA 505 GEL

KEY FEATURES:

  • Bonds rigid durable substrates such as metals, glass, ceramics, concrete and wood in all combinations
  • High tensile strength (2,500 psi)
  • Good solvent resistance to gas, oil and other solvents
  • Non-Sag (No-Drip) which makes it ideal for use on walls and vertical surfaces
  • Excellent gap filling qualities without tremendous shrinkage Fast curing for bond tags on machinery and equipment
  • Functional strength in 1 hour
  • 100% reactive, no solvents

Intended Uses:

  • Bonds metals, fabrics, ceramics, glass, wood, and concrete (and in combinations)
  • Aluminum, Brass, Cast Iron, Copper, Stainless Steel, Carbon Steel & Ferrites, Epoxies, PVC & Vinyls, Woods, Plywoods & Laminates, Particle Boards, Brick, Concrete, Ceramics
  • Popular for filling voids and potting/filler compounds
  • Excellent for bonding to walls and vertical surfaces, and for filling gaps and voids

Physical Properties:

Cured 7 days @ 75° F

Adhesive Tensile Lap Shear[GBS] 2,500 psi @ 0.010" bondline

Dielectric Strength 440 volts/mils

Gap Fill Excellent

Impact Resistance 6.5 ft.lb./in(2)

Service Temperature -40°F to 200°F

Shore Hardness 80 Shore D

Solids by Volume 100

Specific Volume 23.7 in[3]/lb.

Tensile Elongation 5%

Tpeel 2-3 pli

TESTS CONDUCTED

Adhesive Tensile Shear ASTM D 1002 Cured Density ASTM D 792

Dielectric Strength, volts/mil ASTM D 149 Compressive Strength ASTM D 695 Cured Hardness Shore D ASTM D 2240

Uncured

Color Opaque / White-ish

Fixture Time 10-15 min. @ 72°F

Full Cure 48 hrs.

Functional Cure 1.5 hrs. @ 72°F

Mix Ratio by Volume 1:1

Mix Ratio by Weight 1:1

Mixed Density 9.75 lbs/gal.: 1.17 gm/cc

Mixed Viscosity Gel / Thixotropic

Working Time 4-7 min. [28 gm @ 72°F]

SurfacePreparation:

Clean surface by solvent-wiping any deposits of heavy grease, oil, dirt, or other impurities. Surface can also be cleaned with industrial cleaning equipment such as vapor phase degreasers or hot aqueous baths. If working with metal, abrade or roughen the surface to significantly increase the microscopic bond area and increase the bond strength.

Mixing Instructions:

Proper homogenous mixing of resin and hardener is essential for the curing and development of stated strengths. ----

25 ML DEV-TUBE

1. Squeeze material into a small container the size of an ashtray.
2. Using mixing stick included on Dev-tube handle, vigorously mix components for one (1) minute.
3. Immediately apply to substrate.

50 ML/400ML/490 ML CARTRIDGES

1. Attach cartridge to Mark V ™ [50ml] 400ml manual or pneumatic dispensing systems.2. Open tip.
3. Burp cartridge by squeezing out some material until both sides are uniform (ensures no air bubbles are present during mixing).
4. Attach mix nozzle to end of cartridge.

5. Apply to substrate.

Application Instructions:

1. Apply mixed epoxy directly to one surface in an even film or as a bead.

2. Assemble with mating part within recommended working time.
3. Apply firm pressure between mating parts to minimize any gap and ensure good contact (a small fillet of epoxy should flow out the edges to display adequate gap fill.)

For very large gaps:

1. Apply epoxy to both surfaces

2. Spread to cover entire area OR make a bead pattern to allow flow throughout the joint Let bonded assemblies stand for recommended functional cure time prior to handling.

Chemical Resistance:

Chemical resistance is calculated with a 7 day, room temp. cure (30 days immersion) @ 75°F)

Acetic (Dilute) 10%

Poor

Acetone

Poor

Ammonia

Poor

CornOil

Excellent

CuttingOil

Excellent

Ethanol

Poor

Gasoline(Unleaded)

Excellent

Glycols/Antifreeze

Fair

Hydrochloric10%

Poor

Isopropanol

Poor

Kerosene

Excellent

MethylEthylKetone

Poor

MineralSpirits

Excellent

MotorOil

Excellent

SodiumHydroxide10%

Poor

Sulfuric10%

Poor

Precautions:

Please refer to the appropriate material safety data sheet (MSDS) prior to using this product.

For technical assistance, please call 1-800-933-8266

FORINDUSTRIAL USE ONLY